Microsoft will host its annual conference for Build developers next week from 19 to 22 May. The event is guaranteed to include ads regarding new artificial intelligence additions, services and apps, also for Windows.
At the Build last year, Microsoft has announced an integration of Copilot in Microsoft Teams, Copilot+ AI -powered PC, Windows Volumetric App for Meta Quest headphones and more.
The key notes will be transmitted in streaming online for free. As for what to expect, there are good reasons to believe that Microsoft will announce deeper additions for his to the generative of Copilota with many of its software offers, both on the sides of consumers and companies.
The company last November increased prices for many of its software products, including Windows 365, Office 365 and Microsoft 365, among many others, by 5%. To justify these increases, the company could introduce new features and skills based on artificial intelligence.
Copilot is likely to be a Headliner in Build and great changes could be coming. According to reports, Microsoft is testing models to alternatives from Xai, Meta, Anthropic and Deepsek as possible replacements for the Openii technology in Copilot as the relationship between Microsoft and Openi tends.
On Windows, Copilot could obtain “agents” features that allow technology to perform basic activities for PC independently. The well -known Leadercatologia test has found references to an action button in the Copilot client for Windows which, if selected, can start certain “daily activities”.
Microsoft is also said to have developed a family of models never called that they are competitive with Openai’s Own, that the technology giant is taking into consideration the idea of offering an API. The construction could end up being the place where Microsoft decides to reveal them.
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The company could also announce a follow-up to its accelerator to 100 AI, a chip to personalized for Microsoft’s cloud azure service. The voices of a “Maia 2” gathering on social media last week; Marvell chipmaker is contracted to manufacture it, according to the semiconductor analyst Ray Wang.
